Shrink DIP module with 5kV insulating voltage and 2A output current in a 6.8mm x 4.6mm x 3.7mm housing

Toshiba Electronics Europe (TEE) is introducing a miniature photocoupler that features the same insulating and output currents as previous modules in the DIP housing but only requires half the board space.

The new TLP700 is therefore suited for space-saving applications that require high insulations in accordance with international safety standards.

The TLP700 provides an insulating voltage of 5000Vrms and protection against brief and variable transients (CMTR – Common Mode Transient Rejection) of ±10 kV/µs. The module is suited for use in IGBT and powerful MOSFET control circuits and provides a max. output current of 2A, with which it can control low-power IGBTs that delivery up to 50A.

The operating voltage of the TLP700 ranges from 15 to 30V; the current consumption is a low 2mA. The max. switching time is 500ns.

The new photocoupler includes a GaAlAs infrared LED and a photodetector in its small 6.8mm x 4.58mm x 3.65mm, 6-pin SDIP housing. The module meets all international safety standards and guarantees complete performance capability within a temperature range of -40 °C to 100 ºC.

For more information please contact your local SPOERLE Branch Office.