Impact™ Connectors Deliver Increased Speed and Density

Tyco Electronics announces the Impact™ backplane connector system. This connector delivers 20+ Gb/s performance and will be offered in a variety of connector module sizes and types including 3-pair, 4-pair, 5-pair and 6-pair modules for extreme design flexibility. Density within the connector system ranges from 40 contact pairs per inch to 80 contact pairs per inch and header widths from 16.70mm to 28.85mm.

The Impact backplane connector system is designed for increased speed and density to meet future system upgrades and next-generation requirements of data networking and telecommunications equipment. Initial parts will be available beginning mid 2008 with typical production delivery within 6 to 8 weeks.

"Tyco Electronics is excited to add this connector system to our already broad product portfolio of high speed products," said Robert Hnatuck, Tyco Electronics' product manager. "We realize applications that can vary from customer to customer and from one design to the next. Offering choices to our customers is a key strategy and one of our strengths. We also understand the market's demand for multiple sourcing and this product reflects Tyco Electronics commitment to that strategy."

Tyco Electronics and Molex Incorporated have entered into a second sourcing supplier agreement for the Impact product line and the two companies will leverage their global manufacturing capabilities to offer intermateable, interchangeable, interoperable backplane connector solutions. This follows a previous second sourcing agreement in which Molex Incorporated second sources Tyco Electronics' Z-PACK TinMan connector family.

For detailed information please contact your local SPOERLE Branch Office.

© SPOERLE 2008