Single-Chip Inverters for BLDC Motors

TPD412x Family Includes 250 V and 500 V Devices

The TPD412x series single-chip inverters from Toshiba are designed for brushless DC (BLDC) motor applications operating at voltages of up to 500 V. Available in PWM and non-PWM versions, the new inverters integrate into a low-profile DIP26 package (maximum thickness of 3.8 mm) full three phase inverter bridge operation and other key features including integrated protection circuitry and bootstrap diodes.

Toshiba´s new single-chip inverters are perfectly suited for use in home appliances such as refrigerators and washers as well as industrial motion control applications including pumps and fans. Increasingly these products use BLDC motors to deliver high accuracy and long-term reliability together with a more efficient energy use and lower levels of noise and vibration.

Reduced Component Count, Lower Development Cost
Single-chip inverters are a vital element in reducing the component count, complexity, development time and cost of designs based on BLDC motors.
Toshiba´s new TPD412x series inverters combine high and low side drivers with six IGBTs to supply current to the BLDC motor stator coils. The integrated fast recovery bootstrap diodes reduce external component count and cost, while additional onboard functions include protection against overtemperature, overcurrent and undervoltage conditions. The range includes devices with output voltages of 250 V and 500 V. The 250 V inverters offer a 1 A output current, while the 500 V versions are available with output currents of 1, 2 or 3 A. All of the inverters can interface directly with a host microprocessor. Three members of the family also incorporate PWM circuitry and three-phase distribution logic in the same DIP26 package.

27 % Smaller Than HZIP23
Toshiba has used Silicon-on-Insulator (SOI) technology and a trench isolation structure for the new single-chip inverters to bring together low and high voltage circuits in a reliable monolithic device measuring just 32 x 13 mm. The inverters' maximum package thickness of 3.8 mm is 27 % smaller than existing HZIP23 alternatives, while improved thermal resistance reduces requirements for external cooling.

Product Features

>	Full three phase inverter bridge operation – integrated high and low side drivers, six IGBTs

>	Integrated bootstrap diodes

>	Integrated protection against overtemperature, overcurrent and undervoltage

>	250 V/1 A, 500 V/1 A, 500 V/2 A and 500 V/3 A devices

>	PWM and non-PWM versions

>	Microprocessor interface

>	DIP26 package (32 x 13 x 3.8 mm)

Toshiba also provides evaluation boards to allow designers to quickly and easily assess inverter performance in target applications.

Additional Information
For detailed specifications please contact your local SPOERLE Branch Office or visit