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TPD412x Family Includes 250 V and 500 V Devices
The TPD412x series single-chip inverters
from Toshiba are designed for brushless
DC (BLDC) motor applications operating
at voltages of up to 500 V. Available in
PWM and non-PWM versions, the new
inverters integrate into a low-profile
DIP26 package (maximum thickness of
3.8 mm) full three phase inverter bridge
operation and other key features including
integrated protection circuitry and
bootstrap diodes.
Toshiba´s new single-chip inverters are perfectly
suited for use in home appliances such
as refrigerators and washers as well as industrial
motion control applications including
pumps and fans. Increasingly these products
use BLDC motors to deliver high
accuracy and long-term reliability together
with a more efficient energy use and lower
levels of noise and vibration.
Reduced Component Count, Lower Development Cost
Single-chip inverters are a vital element in
reducing the component count, complexity,
development time and cost of designs based
on BLDC motors.
Toshiba´s new TPD412x series inverters
combine high and low side drivers with six
IGBTs to supply current to the BLDC motor
stator coils. The integrated fast recovery
bootstrap diodes reduce external component
count and cost, while additional onboard
functions include protection against
overtemperature, overcurrent and undervoltage
conditions. The range includes devices
with output voltages of 250 V and
500 V. The 250 V inverters offer a 1 A output
current, while the 500 V versions are available
with output currents of 1, 2 or 3 A. All
of the inverters can interface directly with a
host microprocessor. Three members of the
family also incorporate PWM circuitry and
three-phase distribution logic in the same
DIP26 package.
27 % Smaller Than HZIP23
Toshiba has used Silicon-on-Insulator (SOI)
technology and a trench isolation structure
for the new single-chip inverters to bring
together low and high voltage circuits in a
reliable monolithic device measuring just
32 x 13 mm. The inverters' maximum package
thickness of 3.8 mm is 27 % smaller than
existing HZIP23 alternatives, while improved
thermal resistance reduces requirements
for external cooling.
Product Features
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Full three phase inverter bridge operation –
integrated high and low side drivers, six
IGBTs |
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Integrated bootstrap diodes |
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Integrated protection against overtemperature,
overcurrent and undervoltage |
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250 V/1 A, 500 V/1 A, 500 V/2 A and
500 V/3 A devices |
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PWM and non-PWM versions |
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Microprocessor interface |
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DIP26 package (32 x 13 x 3.8 mm) |
Toshiba also provides evaluation boards to
allow designers to quickly and easily assess
inverter performance in target applications.
Additional Information
For detailed specifications please contact
your local SPOERLE Branch Office or visit
www.toshiba.com
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